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Partial File Text * {Z T,» SGS-THOMSON 71 SK aO fflQ IlLlK g'u'M O e i DIE SIZE: METALLIZATION: Top Back BACKSIDE THICKNESS: DIE THICKNESS: PASSIVATION: BONDING PAD SIZE: Source Gate 180x220 mils Al A u /C r/N i/A
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RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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