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Partial File Text I SCS-THOMSON [LIOTMIg® DIE SIZE: METALLIZATION: Top Back BACKSIDE THICKNESS: DIE THICKNESS: PASSIVATION: BONDING PAD SIZE: Source Gate 15 6x1 56 mils Al A u /C r/N i/A u 6100 IRF730 CHIP N -
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RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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IRF730 TESTING transistor IRF730