DSA2IH00173734.pdf by Not Available

Partial File Text SGS-THOMSON m SGSP477 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM · DIE SIZE: · METALLIZATION: Top Back · BACKSIDE THICKNESS · DIETHICKNESS: · PASSIVATION: · BONDING PAD
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RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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