Tusonix recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to ensure efficient heat transfer.
To ensure EMC, use a shielded enclosure, keep the device away from antennas and high-frequency sources, and use a common-mode choke or ferrite bead on the input/output lines. Additionally, follow good PCB layout practices, such as separating analog and digital grounds.
Tusonix recommends using a pi-filter (L-C-L) or a common-mode choke on the input lines to reduce electromagnetic interference (EMI). On the output side, a simple RC filter or a ferrite bead can be used to reduce electromagnetic radiation.
Check the PCB layout for any mistakes or inconsistencies, ensure proper decoupling and bypassing, and verify that the input/output impedances are matched. Also, check for any signs of overheating, and verify that the device is operated within its specified temperature range.
Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the pins or leads. Use anti-static wrist straps and mats when handling the devices to prevent electrostatic discharge (ESD) damage.