Tusonix recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to improve heat dissipation.
To ensure EMC, use a shielded enclosure, keep cables and wires away from the device, and use a common-mode choke or ferrite bead on the input lines. Additionally, follow good PCB layout practices, such as separating analog and digital grounds.
Tusonix recommends using a pi-filter (L-C-R) on the input and output lines to reduce electromagnetic interference (EMI) and improve signal quality. The filter components should be selected based on the specific application and frequency range.
To troubleshoot issues, check the PCB layout, component selection, and soldering quality. Verify that the input and output capacitors are properly selected and installed. Use an oscilloscope to measure the output waveform and identify any signs of oscillation or instability.
Use a high-impedance probe or a differential probe to measure the output voltage. Set the oscilloscope to the correct bandwidth and sampling rate. Use a frequency counter or spectrum analyzer to measure the output frequency and spectral purity.
