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    DSASW0033404.pdf by Carsem

    • MLP Application Note APPLICATION NOTE Comprehensive User's Guide April 2002 April 2002 Cover Page Page 0 MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAG
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    1.7 PC REFLOW PROFILE 6X6 mlp APR-5000 APR5000 CARSEM IPC-7527 IPC-SM-782 IPC7527 jedec package MO-220 64 9x9 Lead Free reflow soldering profile BGA LGA 16L 4X4 lga 4x4 footprint lga components LGA land pattern LGA voiding Material density mlp metcal apr 5000 metcal VPI-1000 mlpq 7X7 package MO-220 MO-220 8x8 MO-229 PCB design for 0.2mm pitch csp package PCB design for very fine pitch csp package QFN 16 CARSEM package outline QFN 3X3 qfn 3X3 land pattern qfn 48 7x7 stencil QFN 64 8x8 footprint qfn 64 8X8 land pattern qfn 64 9x9 stencil QFN 8 CARSEM reflow temperature bga laptop tqfp 100 LAND PATTERN tqfp 100 pcb land pattern tqfp 64 pcb land pattern tssop 16 exposed pad stencil VPI-1000
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