This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
The Dawn of 3D Packaging as System-in-Package (SIP)
Morihiro Kada
Abstract
The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination
memory for cellular phones, was the
