DSA00477442.pdf by Central Semiconductor

Partial File Text PROCESS CPD63 Switching Diode High Speed Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 11 MILS Anode Bonding pad Area
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Active
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Equivalent Parts !
Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

CMPD4448TR CMPD4448TR13 MMBD4448 CMPD4448TIN/LEAD MMBD4448-C

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1N4148 1N4148 chip 1n4148 die 1n4148 die chip 1N4154 1N4448 1N4454 1N914 1N914B CMPD4448 CMPD914 CPD63 DIODE CHIP 1N4148

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