Scans-008848.pdf
by Not Available
-
HMR-10503
GaAs Monolithic Microwave Integrated Circuit
1.0 - 5.0 GHz MMIC AMPLIFIER
Bonding pad widths: 0.075 (.003) Chip thickness: 0.25 (.010) Dimensions in millimeters (inches)
Bonding Pad I
-
Scan
-
Unknown
-
Unknown
-
Unknown
