DSAZIHA100084786.pdf by Central Semiconductor
- PROCESS CPD31X Schottky Rectifier 10 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size 85 x 85 MILS Die Thickness 5.9 MILS ± 0.8 MILS Anode Bonding Pad Area 78 x 78 MIL
- Original
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