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    DSAZIHA100084793.pdf by Central Semiconductor

    • PROCESS CPZ34R Transient Voltage Suppressor 6.2 Volt TVS Chip PROCESS DETAILS Die Size 6.7 x 6.7 MILS Die Thickness 3.54 MILS Anode Bonding Pad Area 4.5 x 4.5 MILS Top Sid
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