DSASL004446.pdf by Texas Instruments

Partial File Text TEXAS INSTRUMENTS Initial Notification for the qualification of Shinetsu-KMC288 Mold Compound at the Malaysia and Mexico Assembly/Test Facilities December 11, 1997 Abstract Texas Instruments, St
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Compound KMC166 KMC288 shinetsu SN74CBT16211 SN74HCT245 Texas Instruments packaging material TEXAS INSTRUMENTS, Mold TEXAS INSTRUMENTS, Mold Compound

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