DSA00186014.pdf by STMicroelectronics

Partial File Text TN0019 Technical note MEMS in QFPN package surface mounting guidelines Introduction This document is a general guideline about soldering MEMS products packaged in Quad Flat Package No lead surfac
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00186014.pdf preview

Download Datasheet

User Tagged Keywords

4x4x1 7551-1 7x7x1 MEMS ic qfn 28 land pattern qfn 44 PACKAGE footprint QFPN 28 footprint QFPN-24 QFPN-28 TN0019