DSA00353897.pdf by Hamamatsu Photonics

Partial File Text TENTATIVE DATA SHEET INFRARED IC INTERNAL INSPECTION SYSTEM C2955 From the backside of the chip, you can see through the silicon substrate to the patterns of the chip by means of an infrared
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C2955 C7103 CCD in a TV camera control using ic 741 die bonding sharp CCD Camera Transformer Inspection Testing