DSA00485592.pdf by Wakefield Engineering

Partial File Text Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621 AND 623 SERIES Low-Profile Heat Sinks for All Metal-Case Power Semiconductors Footprint Dimensions in. (mm) 621A 6
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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