DASF0013416.pdf by Actel

Partial File Text Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package (CSP) is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DASF0013416.pdf preview

Download Datasheet

User Tagged Keywords

AC243 ACTEL FBGA PACKAGE DRAWING BGA PACKAGE thermal profile CS201 CS281 fbga PCB footprint fbga Substrate design guidelines fine BGA thermal profile MO-195 MO-205 pcb thermal Design guide pcb trace thermal pcb guidelines