DSASW00416675.pdf by White Electronic Designs

Partial File Text Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in t
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSASW00416675.pdf preview

Download Datasheet

User Tagged Keywords

flip chip substrate tolerance Pb210