DSASW00416676.pdf by White Electronic Designs

Partial File Text W3H32M72E-XSBX Application Note W3H32M72E-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moistu
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSASW00416676.pdf preview

Download Datasheet

User Tagged Keywords

Price & Stock Powered by