DSAUTAZ001062.pdf by Advanced Micro Devices

Partial File Text TECHNOLOGY BACKGROUND &KLS6FDOH 3DFNDJLQJ IRU $0' )ODVK 0HPRU\ 3URGXFWV 2 Chip-Scale Packaging Technology Background The AMD Fine-pitch Ball Grid Array (FBGA) The FBGA package offers syst
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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