DSASW00419407.pdf by X-FAB Semiconductor Foundries

Partial File Text 1.0 µm BCD Process XDM10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 350V Trench Insulated BCD Process Thick SOI material together with area efficient deep trench insulation allows the design
Datasheet Type Original
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Pb Free Unknown
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"X-Fab" nd25c ND32A XDM10