DSASW00420057.pdf by Xilinx

Partial File Text 665 Ball Flip-Chip BGA (FF665) Package PK220 (v1.1) August 5, 2009 X-Ref Target - Figure 1 BOTTOM VIEW TOP VIEW 0.20 (4X) D1 25 24 23 22 21 20 19 18 17 16 15
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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EF665 FF665 FFG665 ms-034-aal-1 PK220 pk2200 Solder Balls