Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAUTAZ0010887.pdf by Microchip Technology

    • M Author: Youbok Lee, Ph.D. Microchip Technology Inc. AN830 Since the direct die attachment reduces a step for making the COB package, it is widely used for low cost and high volume applications
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Powered by Findchips

    DSAUTAZ0010887.pdf preview

    Supplyframe Tracking Pixel