DSAUTAZ0011155.pdf by Microchip Technology

Partial File Text AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team The heat from soldering causes a buildup of additional stresses withi
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAUTAZ0011155.pdf preview

Download Datasheet

User Tagged Keywords

78610 AN598 barber excursion delamination leadframe Moisture Sensitivity Levels MICROCHIP PIC Package