1SMB5929B-13 datasheet by Diodes Incorporated

1SMB5929B-13 Frequently Asked Questions (FAQs)

• What is the recommended footprint and land pattern for the 1SMB5929B-13?
  The recommended footprint and land pattern for the 1SMB5929B-13 can be found in the Diodes Incorporated's application note AN-114, which provides guidelines for PCB layout and assembly.
• How do I ensure the 1SMB5929B-13 is properly soldered and assembled?
  To ensure proper soldering and assembly, follow the recommended soldering profile and handling procedures outlined in the Diodes Incorporated's application note AN-115, which provides guidelines for surface mount assembly.
• What are the thermal management considerations for the 1SMB5929B-13?
  The 1SMB5929B-13 has a thermal resistance of 25°C/W. To ensure proper thermal management, a thermal pad or heat sink may be required, especially in high-power applications. Consult the datasheet and application notes for more information.
• Can the 1SMB5929B-13 be used in automotive applications?
  The 1SMB5929B-13 is an AEC-Q101 qualified device, making it suitable for automotive applications. However, it's essential to consult the datasheet and application notes to ensure the device meets the specific requirements of your automotive application.
• What are the ESD protection considerations for the 1SMB5929B-13?
  The 1SMB5929B-13 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). To ensure proper ESD protection, follow the recommended handling and assembly procedures outlined in the Diodes Incorporated's application notes.