The recommended footprint and land pattern for the 1SMB5928B-13 can be found in the Diodes Incorporated's application note AN-114, which provides guidelines for PCB layout and assembly.
To ensure proper soldering and assembly, follow the recommended soldering profile and handling procedures outlined in the Diodes Incorporated's application note AN-115. Additionally, ensure that the PCB is designed with a suitable thermal relief pattern to prevent thermal stress on the device.
The 1SMB5928B-13 has a maximum junction temperature of 150°C. To ensure reliable operation, provide adequate heat sinking and thermal management on the PCB, such as thermal vias, thermal pads, and heat sinks. Follow the thermal management guidelines outlined in the datasheet and application notes.
The 1SMB5928B-13 is a commercial-grade device, but Diodes Incorporated offers automotive-grade and high-reliability versions of the device, such as the 1SMB5928B-13-Q or 1SMB5928B-13-HR. Contact Diodes Incorporated for more information on these variants.
The 1SMB5928B-13 has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. Use ESD-safe materials, grounding straps, and follow the ESD handling guidelines outlined in the datasheet and application notes.
1SMB5928B-13 datasheet
by Diodes Incorporated
