DSA2IH0051123.pdf by Not Available

Partial File Text APPLICATION NOTES APPLICATION NOTES I. PACKAGED FETs and MODULES A. Handling Precautions B. Circuit Installation C. Package Markings II. FET CHIPS A. Removal of GaAs FET and HEMT Chips From Shipping
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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