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    DSAUTAZ0012778.pdf by OKI Electric Industry

    • DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-3
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