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    DSAUTAZ0014815.pdf by Philips Semiconductors

    • PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm D D1 SOT466-1 ball A1 index E1 E detail X A2 A1
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    BGA256 BGA256 17 X 17 sot466
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