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Partial File Text 1"KM P A C K A R D HEW LETT* Schottky Barrier Chips for Hybrid Integrated Circuits Technical Data HSMS-0005/06 HSMS-8002/12 Features · T herm ocom pressioii/ Therntosonically Bondable ·
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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