This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
MOTOROLA
Order this document
EB211
by EB211/D
SEMICONDUCTOR ENGINEERING BULLETIN
EB211
Thermal Management and Solder Mounting Method
for the MRF286, 60 Watt Power Device in a CuW
(Copper