The recommended PCB footprint for the 10BQ060TRPBF is a standard TO-220FP package with a minimum pad size of 6.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below the maximum rated value of 150°C.
The maximum allowed voltage spike for the 10BQ060TRPBF is 20V, and it is recommended to use a voltage clamp or transient voltage suppressor to protect the device from voltage spikes exceeding this value.
Yes, the 10BQ060TRPBF can be used in a parallel configuration to increase current handling, but it is recommended to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reliability issues.
The recommended gate drive voltage for the 10BQ060TRPBF is 10V to 15V, and it is recommended to use a gate driver with a high current capability to ensure fast switching times and low power losses.
10BQ060TRPBF datasheet
by International Rectifier
