1.5KE7V5CA datasheet by STMicroelectronics

1.5KE7V5CA Frequently Asked Questions (FAQs)

• What is the recommended footprint for the 1.5KE7V5CA?
  The recommended footprint for the 1.5KE7V5CA is a DO-201AD package with a minimum pad size of 2.5mm x 1.5mm and a maximum pad size of 3.5mm x 2.5mm.
• Can I use the 1.5KE7V5CA in a high-temperature environment?
  The 1.5KE7V5CA is rated for operation up to 150°C, but it's recommended to derate the power dissipation above 125°C to ensure reliable operation.
• How do I handle the 1.5KE7V5CA's high peak pulse power rating?
  The 1.5KE7V5CA's high peak pulse power rating requires careful PCB design and layout to ensure that the device can dissipate heat effectively. A heat sink or thermal pad may be necessary to prevent overheating.
• Is the 1.5KE7V5CA compatible with lead-free soldering processes?
  Yes, the 1.5KE7V5CA is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's recommended soldering profile to ensure reliable assembly.
• Can I use the 1.5KE7V5CA in a circuit with high-frequency switching?
  The 1.5KE7V5CA is designed for high-voltage and high-power applications, but it may not be suitable for high-frequency switching applications due to its relatively high capacitance and inductance. Additional filtering or decoupling may be necessary to ensure reliable operation.