The recommended footprint and land pattern for the 1.5KE33CA-TP can be found in the manufacturer's application notes or on their website. Typically, a standard SOD123 footprint with a 0.65mm x 0.55mm pad size is recommended.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 220°C, and avoid applying excessive heat or force during soldering. Inspect the solder joints for defects such as cold joints, bridges, or opens.
The 1.5KE33CA-TP has a thermal resistance of 25°C/W. Ensure proper heat dissipation by providing a thermal pad or heat sink, and maintaining a maximum operating temperature of 150°C. Follow the manufacturer's thermal management guidelines for optimal performance.
The 1.5KE33CA-TP is a commercial-grade component, but it may not meet the stringent requirements of high-reliability or aerospace applications. For such applications, consider using a component with a higher reliability rating, such as a MIL-PRF-19500 or NASA-approved component.
Handle the 1.5KE33CA-TP with ESD-protective materials, such as wrist straps, mats, or bags. Store the components in their original packaging or in a conductive container to prevent ESD damage. Follow the manufacturer's ESD handling and storage guidelines.
1.5KE33CA-TP datasheet
by Micro Commercial Components
