DSASL0059695.pdf by Linear Technology

Partial File Text Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides pe
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AN114 bga dye pry LGA PACKAGE thermal resistance LGA rework LGA voiding LTM4600 LTM46XX

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