DSA00158475.pdf by Central Semiconductor

Partial File Text PROCESS Triac CPQ110 8 Amp, 600 Volt Triac Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETR
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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