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    DSA00332066.pdf by Microsemi

    • GaAs Flip Chip PIN Diodes ® TM MP6250 ­ P2715 Dimensions Size: 27.5 x 15 mils Thickness: 5 mils Bond Pad Size: 3.5 x 8.4 mils Features Low Capacitance (45 fF Typ.) Low Seri
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