DASF004134.pdf by Freescale Semiconductor

Partial File Text Freescale Semiconductor Application Note AN1907 Rev. 1, 6/2006 Solder Reflow Attach Method for High Power RF Devices in Plastic Packages By: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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AN1907 MRF9045NR1 RF Power Devices

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