DSA00367626.pdf by Infineon Technologies

Partial File Text Power Amplifier for Bluetooth, Home RF and WLAN applications 1 Solder Bump 2 Under Bump Metallization 3 4 2 3 4 Chip Passivation 5 GaAs 5 Products Technology
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00367626.pdf preview

Download Datasheet

User Tagged Keywords

CGB240 CGY196 CGY63 InGaP HBT SCT-598 T628B TSSOP-10 TSSOP10 tSSOP10 Package