DSA00367866.pdf by Advanced Micro Devices

User Tagged Keywords

50um silicon die attach 84 FBGA outline 84 FBGA thermal 8x9 bga AM29DL32XD Am29DL640D AM29DL640X AM29LV017D THERMAL RESISTANCE AMD 754 socket pinouts AMD Application Note, number 22142 amd k10 AMD reflow soldering profile BGA AMD Stacked CSP 1999 BGA Solder Ball 0.6mm BGA-64 pad Bonding Diagram TSOP48 CRAM 256mb Euro 64 FBGA 12 x 12 heat slug FBGA 63 Socket FBGA heat slug fbga heat slug for JEDEC FGB048 fluke 52 k/j Thermocouple gold metal detectors IC SOCKET TSOP48 SMT Infrared-Sensor Intel Stacked CSP 1997 MAKING A10 BGA marking code EY SMD MCP Technology Trend outline of the heat sink for Theta JC outline off the heat sink for fbga with jedec stand pcb thermal Design guide trace theta layout pcb thermal Design guide trace theta layout via schematic diagrams fluke smd mark code zzz smd marking A26 SMD MARKING CODE A12 SMD MARKING CODE A20 SMD MARKING CODE h5 SMD MARKING CODE l6 smd marking e5 rf smd marking g8 solder ball 0.3mm profile spark gap sram 64mb ST EZ 728 Theta JC of FBGA tsop Ir sensor tsop sensor pcb layout TSOP48 Thermal uBGA device MARKing intel