DSAUD0068014.pdf by Texas Instruments

Partial File Text Thermally Enhanced ICs Low Cost Plastic Package Improves Surface-Mount IC Cooling Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter, Texas Instruments, Incorporate
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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