DSAUD0068659.pdf by Altera

Partial File Text Reflow Soldering Guidelines ® June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera's surface-mount products include quad flat pack (QFP), J-lead chip carr
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BGA and QFP Altera Package mounting GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 IPC-SM-786 IPC-SM-786A moisture sensitive handling and packaging Solder paste floor life

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