0ZRB0400FF1A datasheet by Bel Fuse

0ZRB0400FF1A Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the 0ZRB0400FF1A?
  The recommended PCB footprint for the 0ZRB0400FF1A is a rectangular pad with dimensions of 4.5mm x 2.5mm, with a 1.5mm diameter hole in the center for the pin.
• Can the 0ZRB0400FF1A be used in high-temperature applications?
  Yes, the 0ZRB0400FF1A is rated for operation up to 125°C, making it suitable for high-temperature applications. However, derating may be necessary for prolonged exposure to high temperatures.
• Is the 0ZRB0400FF1A compatible with lead-free soldering processes?
  Yes, the 0ZRB0400FF1A is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
• What is the typical power dissipation of the 0ZRB0400FF1A?
  The typical power dissipation of the 0ZRB0400FF1A is 4W, but this can vary depending on the specific application and operating conditions.
• Can the 0ZRB0400FF1A be used in high-reliability applications?
  Yes, the 0ZRB0400FF1A is designed for high-reliability applications and meets the requirements of various industry standards, including MIL-PRF-19500 and NASA-STD-8739.