The recommended PCB footprint for the 0ZCD0125FF2C is a rectangular pad with dimensions of 2.5mm x 1.25mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the 0ZCD0125FF2C is -40°C to 125°C, with a derating of 1.33mA/°C above 80°C.
Yes, the 0ZCD0125FF2C is designed to withstand high-vibration environments, with a vibration resistance of 10G peak acceleration, 10-2000Hz frequency range.
To handle ESD protection, use an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Handle the component by the body, not the leads, and avoid touching the component's electrical contacts.
