DSAASSA00012313.pdf by Amkor Technology

Partial File Text data sheet Features LAMINATE FCMBGA ·Single substrate molding ·4-10 layer build up and coreless substrates ·150 µm minimum bump pitch ·Die sizes up to 20 mm ·Body sizes up to 42.5 mm ·JEDEC MS
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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"IPC-9701" amkor flip Amkor mold compound coreless substrate IPC-9701

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