DASF007269.pdf by Integrated Device Technology

Partial File Text Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE (PCN) PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see a
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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71256SA10PZ 71256SA15PZ 71256SA20PZ 71256SA20PZI 71256SA25PZI 71T016SA10PHI 71T016SA15PHI 71v416l10 71V416L15PH 71V416S10PHI 71V416S15PHI 71V424L 71V424L10PHI 71V424L12PH 71V424L12PHI 71V424L15PH 71V424L15PHI Ablebond 190 ablebond 3230 Ablebond 8390 ablebond 8390 cure time Ablebond 84-1*SR4 ablebond ablestik ablebond technical Ablecube Ablestik ablestik 8390 ablestik ablebond Ablestik ablebond 3230 coefficient of thermal expansion of thermal conductive pressure sensitive adhesive Compound EME-G700 EIA/JESD22-B116 EME-G700 EME-G700 datasheet EMEG700 G700 SUMITOMO Tg JEDEC JESD22-B116 free KMC-184 SB-U-02-004 SB-U-03-002 SB-U-03-018 SB-U-04-043 SR-0212-02 SR02120 sumikon SUMIKON EME-G700 SUMITOMO EME G700 SUMItomo EME-G700 Sumitomo EME-G700 material SUMITOMO G700 sumitomo G700 Tg sumitomo g700 type s TSOP 44 Pattern

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