DASF007418.pdf by Altera

Partial File Text AN 353: Reflow Soldering Guidelines for Lead-Free Packages © February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-fre
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DASF007418.pdf preview

Download Datasheet

User Tagged Keywords

GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE J-STD-020D JEDEC J-STD-020d.1 Lead Free reflow soldering profile BGA pcb warpage in ipc standard pcb warpage* in smt reflow Soldering guidelines

Price & Stock Powered by