DASF007418.pdf by Altera

Partial File Text AN 353: Reflow Soldering Guidelines for Lead-Free Packages © February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-fre
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
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GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE J-STD-020D JEDEC J-STD-020d.1 Lead Free reflow soldering profile BGA pcb warpage in ipc standard pcb warpage* in smt reflow Soldering guidelines