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    DSAUTAZ003331.pdf by Siemens

    • Taping and Packing 1 1.1 Taping of chip capacitors Blister tape (taping in accordance with IEC 286-3) Section A­A Direction of unreeling Dimensions (mm) A0 × B0 K0 T2 D0 D1 P0 P2 P1 W E
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