DSASDKL10005368.pdf by NXP Semiconductors

Partial File Text Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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