DSA00505760.pdf by National Semiconductor

Partial File Text Plastic Package Moisture-Induced Cracking Introduction Problem Summary With the older "through-hole" technology packages such as the Dual In-line Package (DIP), soldering to printed circuit b
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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J-STD-033B JEDEC J-STD-033b LEAD FRAME SURFACE MOUNT MIL-B-81705 MIL-D-3464 MIL-D-3464 type 1 MIL-D-3464 type 1 and 2 MIL-D-3464 type 2 MILD-3464 QFP JEDEC tray

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